Telink泰凌微电子（上海）有限公司成立于2010年6月，是一家致力于研发高性能低功耗无线物联网系统级芯片的设计公司。Telink泰凌微电子公司总部位于上海张江高科技园区，除亚太地区的多个子公司外，在北美、欧洲、印度也设有子公司或办事处。

Telink泰凌微电子公司的主营业务是集成电路芯片的设计及销售，并提供相关技术咨询和技术服务。目前Telink泰凌微电子公司主要销售的芯片包括蓝牙低功耗，Zigbee，6LoWPAN/Thread，苹果HomeKit，和私有协议等低功耗2.4Ghz无线芯片，涉及的行业领域有智能照明，智能家居，可穿戴类，无线外设，无线玩具，工业控制，智慧城市等物联网和消费类电子相关产品。

Telink泰凌微电子拥有高水平的芯片设计能力和丰富的芯片设计经验，在多模物联网芯片的研发上更是居于行业前列。Telink泰凌微电子致力于向客户提供高性能高品质的产品，帮助客户快速推出新产品，并建立长期稳定互惠互利的合作关系。

Telink泰凌微电子致力于物联网芯片的开发。不仅仅是传统意义上的物联网，而是更高层面上的万物互联。我们的芯片高性能，高性价比， 助力不同领域的客户，推出多种富有创造性，性能强大， 使用方便的产品。Telink泰凌微电子的芯片解决方案完美平衡了系统成本和性能，帮助物联网客户用最高效率实现最佳功能，在市场竞争中占得先机。Telink泰凌微电子支持多种协议，助力客户推出具有市场前瞻性的产品。

Telink is a global leader in the semiconductor space focused on building innovative solutions for IoT devices. We leverage a robust product portfolio to solve for exacting requirements and help our clients take cutting-edge products to market. Our global team spans North America, Europe, and APAC.

Founded in 2010, Telink is dedicated to building the future of the Internet of Things. Our best-in-class research and development team, strategic technology partnerships, and global supply chain ecosystem together make Telink the leading SoC producer focused on IoT implementations in the world.

Telink creates custom SoCs for the IoT. Not the internet of things as it is, but as it should be — the one where everything just works. With high-performing, cost-efficient integrated circuits, we enable innovative devices with rich feature sets and out-of-the-box functionality across every vertical. Our solutions maximize performance and achieve competitive pricing at scale for a roster of pioneering clients across the connected device space. We are protocol agnostic and we’re building chips that will power the products of the future.